At CERN, the European Organization for Nuclear Research, physicists and engineers are probing the fundamental structure of the universe. Using the world's largest and most complex scientific instruments, they study the basic constituents of matter - fundamental particles that are made to collide together at close to the speed of light. The process gives physicists clues about how particles interact, and provides insights into the fundamental laws of nature. Find out more on http://home.cern.
Are you a Wire Bonding and Interconnection Technical Engineer with experience in ultrasonic Aluminium wedge wire bonding as well as an interest in micro-connectivity and packaging of electronics and complex particle detector systems? Then seize the opportunity and join the Detector Technology group operating at the heart of CERN Experimental Physics Department. Within our team, you will contribute to the development and construction of leading-edge technical solutions for the next generation of particle detectors. Take part!
You will join:
EP-DT Website: http://ep-dep-dt.web.cern.c
As Wire Bonding and Interconnection Technical Engineer in the Detector Development Section, you will be responsible for providing wire bonding for a diverse clientele from all experiments as well as different projects at CERN. Together with the Bondlab manager you will ensure timely completion of the requests and provide feed-back as well as advice to the clients. You will support new requests with your expert knowledge to achieve optimized connections and help to develop new concepts in the field of interconnections. Furthermore, you will be part of the daily operation of the lab and contribute to the maintenance and operation of equipment and infrastructure.
The Bondlab provides a service that includes mounting of electronics and solid-state detectors on printed circuit boards and flexible printed circuit boards and their connection using ultra-sonic aluminium wedge wire bonding using state of the art automatic bonding machines. Work requests range from R&D projects to small and medium size productions with several hundred pieces. The Bondlab is located in a class 7 cleanroom and is equipped with automatic wire bonding machines, pull tester, several inspection microscopes, pick and place machines as well as other auxiliary equipment. The Bondlab also provides expert advice for new projects for all matters related to connectivity of chips and particle detectors and participates together with the neighbouring QARTlab in reliability tests.
Bachelor's degree or equivalent relevant experience in the field of electronics / elecromechanics or a related field.
Spoken and written English or French: ability to draw up technical texts in one of the two languages; good knowledge of both languages would be an asset
Eligibility and closing date:
Diversity has been an integral part of CERN's mission since its foundation and is an established value of the Organization. Employing a diverse workforce is central to our success. We welcome applications from all Member States and Associate Member States.
This vacancy will be filled as soon as possible, and applications should normally reach us no later than 27.08.2021 at 12:00 pm CET (midday).
Contract type: Limited duration contract (5 years). Subject to certain conditions, holders of limited-duration contracts may apply for an indefinite position.
These functions require:
Job grade: 4-5
Job reference: EP-DT-DD-2021-90-LD
Benchmark Job Title: Electromechanical Technical Engineer
Please make sure you have all the documents needed to hand as you start your application, as once it is submitted, you will not be able to upload any documents or edit your application further